The MAX1566/MAX1567 provide a complete powersupply solution for digital cameras. They improve performance, component count, and size compared to conventional multichannel controllers in 2-cell AA, 1-cell lithium-ion (Li+), and dual-battery designs. On-chip MOSFETs provide up to 95% efficiency for critical power supplies, while additional channels operate with external FETs for optimum design flexibility. This optimizes overall efficiency and cost, while also reducing board space.
The MAX1566/MAX1567 include six high-efficiency DCto-DC conversion channels:
• Step-up DC-to-DC converter with on-chip power FETs
• Main DC-to-DC converter with on-chip FETs, configurable to step either up or down
• Step-down core DC-to-DC converter with on-chip FETs
• DC-to-DC controller for white LEDs or other output
• Extra DC-to-DC controller (typically for LCD); two extra controllers on the MAX1566
• Transformerless inverting DC-to-DC controller (typically for negative CCD bias) on the MAX1567
All DC-to-DC channels operate at one fixed frequency settable from 100kHz to 1MHz to optimize size, cost, and efficiency. Other features include soft-start, power-OK outputs, and overload protection. The MAX1566/MAX1567 are available in space-saving 40-pin thin QFN packages. An evaluation kit is available to expedite designs.
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Digital CamerasPDAs
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95% Efficient Step-Up DC-to-DC Converter0.7V Minimum Input VoltageMain DC-to-DC Configurable as Either Step-Up or Step-DownCombine Step-Up and Step-Down for 90% Efficient Boost-Buck95% Efficient Step-Down for DSP CoreRegulate LED Current for Four, Six, or More LEDsOpen LED Overvoltage ProtectionTransformerless Inverting Controller (MAX1567)Three Extra PWM Controllers (Two on the MAX1567)Up to 1MHz Operating Frequency1µA Shutdown ModeSoft-Start and Overload ProtectionCompact 40-Pin 6mm x 6mm Thin QFN Package
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PV, PVSU, SDOK, AUX1OK, SCF, ON_, FB_,
SUSD to GND..................................................... -0.3V to +6V
PG_ to GND.......................................................-0.3V to +0.3V
DL1, DL3, INDL2, PVM, PVSD to GND...-0.3V to (PVSU + 0.3V)
DL2 to GND .........................................-0.3V to (INDL2 + 0.3V)
LXSU Current (Note 1) ......................................................3.6A
LXM Current (Note 1) ........................................................3.6A
LXSD Current (Note 1) ....................................................2.25A
REF, OSC, CC_ to GND...........................-0.3V to (PVSU + 0.3V)
Continuous Power Dissipation (TA = +70°C)
40-Pin Thin QFN (derate 26.3mW/°C above +70°C) .2105mW
Operating Temperature Range ........................-40°C to +85°C
Junction Temperature...................................................+150°C
Storage Temperature Range .........................-65°C to +150°C
Lead Temperature (soldering, 10s) ..............................+300°C
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